针对更精确电迁移预测应用的热耦合模型建模  

Thermal Coupling Modeling for More Accurate Electromigration Prediction

作　　者：杨双 石新新 伍宏 粟雅娟[3,5] 董立松[3] 陈睿 张利斌[3] 苏晓菁 陈颖 盖天洋[1,3] 郭成 屈通 韦亚一 YANG Shuang;SHI Xinxin;WU Hong;SU Yajuan;DONG Lisong;CHEN Rui;ZHANG Libin;SU Xiaojing;CHEN Ying;GAI Tianyang;GUO Cheng;QU Tong;WEI Yayi(University of Chinese Academy of Sciences,Beijing 100049,P.R.China;Semiconductor Manufacturing International Corporation,Shanghai 201203,P.R.China;Integrated Circuits Advanced Process R&D Center,IMECAS,Beijing 100046,P.R.China;Key Laboratory of Microelectronic Devices&Integrated Technology,IMECAS,Beijing 100029,P.R.China;Institute of Integrated Circuits and Systems Applications,Dawan District,Guangdong Province,Guangzhou 510535,P.R.China)

机构地区：[1]中国科学院大学,北京100049 [2]中芯国际集成电路制造有限公司,上海201203 [3]中国科学院微电子研究所集成电路先导工艺研发中心,北京100029 [4]广东省大湾区集成电路与系统应用研究院,北京100029 [5]中国科学院微电子研究所微电子器件与集成技术重点实验室,广州510535

出　　处：《微电子学》2020年第5期732-737,共6页Microelectronics

基　　金：国家自然科学基金资助项目(61804174);国家重大专项资助项目(2017ZX02315001);国家科技重大专项资助项目(2017ZX02101004)。

摘　　要：基于先进逻辑CMOS工艺平台,构建了集成电路热耦合模型,为后端金属线电迁移预测提供更精确的温度变化和分布信息。在建模过程中,为了提高建模和仿真效率,对金属线网络和晶体管有源区进行简化,并用热传输比率对热耦合进行表征。考虑到晶体管参数、金属线走向、金属线之间相对位置对热传输比率的影响,模型中引入相关因子对热传输比率做进一步修正。最后,将该热传输模型嵌入到商用仿真软件中。结果表明,热传输比率(即温度)的仿真值与基于工艺平台流片的实测值吻合良好,验证了模型的准确性。Based on advanced logic CMOS technology platform,a thermal coupling model had been built for the purpose of a more accurate prediction of the metal interconnect’s temperature change and distribution in IC’s.During the model setup,the metal wire network and the transistor active area were simplified to improve the efficiency of modeling and simulation,and the thermal transmission ratio was used to characterize the thermal coupling effect.More factors were added to the model in order to reflect the influence to the thermal transmission ratio by the transistor parameters,the orientation and the relative position of the metal wires.In the end,the thermal coupling model was embedded into a commercial simulation tool.The simulation results showed that simulated value of the heat transfer ratio(i.e.,temperature)was in good agreement with the actual value based on the process platform.The model accuracy was verified.

关 键 词：热耦合模型 热传输比率 金属线 有源区 电迁移 

分 类 号：TN406[电子电信—微电子学与固体电子学]