BGA焊点共面度的特殊结构光投影测量技术  

Structural light projection technique for measuring ball grid array coplanarity

作　　者：马少鹏[1] 金观昌[1] 李江城[1] 

机构地区：[1]清华大学工程力学系,北京100084

出　　处：《清华大学学报（自然科学版）》2002年第11期1488-1491,共4页Journal of Tsinghua University(Science and Technology)

基　　金：国家自然科学基金资助项目(69878014)

摘　　要：为了解决球栅阵列(BGA)焊点共面度在线检测问题,发展了一种特殊的结构光投影技术。用环形光发射二极管(LED)照明BGA芯片,通过环形灯的中心,布置二个电荷耦合器(CCD)摄像机从不同的角度记录小球上圆环的图像。提出了一个简化的算法,根据两幅图像的差异,可以完成整个BGA芯片的共面度测量。用钢珠和BGA芯片进行的实验验证了方法的精度和可行性。A novel structural light projection technique was developed for ball grid array (BGA) coplanar inspection. A light emitting diode (LED) ring light was used to illuminate the BGA package with two chargecoupled devices (CCDs) to capture the doughnut images through the center hole of the ring light. A simple algorithm was used to calculate the coplanarity of all the BGA balls from the difference between the two images. Experiments with steel balls in a BGA package prove the accuracy of the method. 

关 键 词：BGA焊点 共面度 结构光投影测量技术 球栅阵列 集成电路 质量检测 

分 类 号：TN407[电子电信—微电子学与固体电子学]