原位红外光谱法研究聚丁二烯树脂的固化反应  

Study on curing reaction of polybutadiene resin by in situ infrared spectroscopy

作　　者：颜善银[1] 介星迪 王小兵[1] 杨中强[1] Yan Shanyin;Jie Xingdi;Wang Xiaobing;Yang Zhongqiang(Shengyi Technology CO.,LTD,National Engineering Research Center for Electronic Circuits Base Materials.Dongguan 523808,China)

机构地区：[1]广东生益科技股份有限公司,国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《印制电路信息》2020年第10期9-11,共3页Printed Circuit Information

摘　　要：用原位红外光谱技术实时监测聚丁二烯树脂的反应过程。实验结果表明,在相同的反应时间,提高反应温度,可以提高双键反应程度。使用引发剂时,将固化温度从190℃提高到220℃左右,可以提高体系中双键的反应程度。The reaction process of polybutadiene resin is monitored by situ infrared spectroscopy.The experimental results show that the degree of double bond reaction can be increased by increasing the reaction temperature at the same reaction time.It shows that when initiator is used,if the curing temperature is increased from 190℃to 220℃,the reaction degree of double bond in the system can be improved.

关 键 词：聚丁二烯树脂 原位红外光谱 固化反应 覆铜板 

分 类 号：TN41[电子电信—微电子学与固体电子学]