数字信号处理电路板微焊接失效机理分析与可靠性评估  

Micro welding failure mechanism analysis and reliability evaluation of the digital signal processing circuit board

作　　者：张爱菊[1] 李晓聪[1] 王婕[1] 刘新胜[1] 王孟龙 Zhang Aiju;Li Xiaocong;Wang Jie;Liu Xinsheng;Wang Menglong(China North Vehicle Research Institute,Beijing,100072)

机构地区：[1]中国北方车辆研究所,北京100072

出　　处：《电子测试》2020年第23期33-37,13,共6页Electronic Test

基　　金：国家型号项目(01-01-01-041-34)。

摘　　要：针对电子电气系统中数字信号处理(Digital Signal Processing,DSP)电路板组件的超大规模集成电路球栅阵列(Ball Grid Array,BGA)封装器件焊点可靠性问题,结合金相分析和扫描电镜(Scanning Electron Microscope,SEM)等手段对BGA焊点质量和可靠性的试验分析,实现焊接工艺优化,进而确定一类电路板回流焊接工艺。结果显示,焊接工艺改进后电路板焊接可靠性得到显著提高,满足了军用级别产品使用年限。Aiming at the solder joint reliability problem of BGA package device in DSP circuit board embedded in electronic and electrical system,a kind of reflow soldering process of circuit board is established through the optimized welding temperature curve based on the analysis of the micro welding point quality and reliability test combined with the technologies of X-Ray graph,metallographic analysis and SEM.The results show that the reliability of the circuit welding has been significantly improved,and satisfies the service life of the military grade.

关 键 词：DSP电路板 焊接工艺优化 BGA焊点 可靠性 

分 类 号：TN911.72[电子电信—通信与信息系统]