SMT焊点疲劳寿命的预估  

Prediction of SMT Solder Joint Fatigue Life

作　　者：刘新胜[1] 李晓聪[1] 杨丽娜[1] 兰治军 王萍[1] 张瑶[1] 徐璐[1] 王婕[1] LIU Xinsheng;LI Xiaocong;YANG Lina;LAN Zhijun;WANG Ping;ZHANG Yao;XU Lu;WANG Jie(China North Vehicle Research Institute,Beijing 100071,China)

机构地区：[1]中国北方车辆研究所,北京100071

出　　处：《新技术新工艺》2020年第11期70-75,共6页New Technology & New Process

基　　金：兵器工业集团共性基础工艺科研项目。

摘　　要：表面组装工艺的优劣直接影响印制电路板组件的质量及可靠性,进而对整机系统的可靠性能产生决定性影响。特别是,无铅元器件有铅焊料的混装技术较为复杂,相比传统有铅工艺,具有更高的焊接峰值温度和更窄的工艺窗口。其焊点失效主要是由于产品周期性工作导致的温度变化以及外界环境周期性的温度变化,导致产品的互连焊点发生周期性的应力应变作用,引起焊点的热疲劳和蠕变疲劳,进而发生互连失效。为提升电子产品的质量和可靠性,基于PCBA组件的典型工作剖面及装备使用的环境条件,以组件中有高可靠性风险的器件为工艺研究对象,制备了菊花链线路的寿命评估板,设定典型应力水平的温度循环开展试验,并根据加速模型进行外推,预测了焊点寿命数据。The good and bad of the surface assembly process directly affected the quality and reliability of the printed circuit board components and finally affected the reliability of the whole system.In particular,the mixing technology of lead-free components with lead solder was more complicated,and had a higher peak soldering temperature and a narrower process window than that of the traditional leaded process.The failure of the solder joints was mainly due to the temperature changes caused by the periodic work of the product and the periodic temperature changes of external environment,which resulted in periodic stress and strain effects on the interconnect solder joints of the products,and caused thermal fatigue and creep fatigue of the solder joints,then an interconnection failure occurred.In order to improve the quality and reliability of electronic products,based on the typical working profile of PCBA components and the environmental conditions that the equipment used,the components with high reliability risks in the components were used as the research process objects to prepare the life evaluation board of the daisy chain circuit,the temperature cycle test was carried out with a typical stress level,and the acceleration model was extrapolated to predict the solder joint life data.

关 键 词：焊点疲劳寿命 混装焊点 菊花链测试结构 温度循环 加速试验 可靠性 

分 类 号：TG405[金属学及工艺—焊接]