CMP加工后芯片三维形貌表征参数体系  

Parameter System for Characterization of 3D Morphology of Chip after CMP Processing

作　　者：黄静飞 任志英[1,2] 罗德海[1] 路纯红 HUANG Jingfei;REN Zhiying;LUO Dehai;LU Chunhong(School of Mechanical Engineering and Automation,Fuzhou University,Fujian Fuzhou 350116,China;Engineering Research Center for Metal Rubber,Fuzhou University,Fujian Fuzhou 350116,China;Department of Automotive Engineering,Hebei College of Industry and Technology,Hebei Shijiazhuang 050091,China)

机构地区：[1]福州大学机械工程及自动化学院,福建福州350116 [2]福州大学金属橡胶工程研究中心,福建福州350116 [3]河北工业职业技术学院汽车工程系,河北石家庄050091

出　　处：《摩擦学学报》2020年第6期716-725,共10页Tribology

基　　金：国家自然科学基金项目(51805086/51975123);福建省自然科学基金项目(2019J01210);福建省卫生教育联合攻关计划项目(2019-WJ-01)资助。

摘　　要：针对当前化学机械抛光(chemical mechanical polishing,CMP)后的芯片表面形貌的表征常常只停留在研究二维轮廓特征,无法完整地表达整个三维表面形貌信息,仅使用单一的评定指标来表征其表面的不平整程度等问题,建立了1个科学、全面的芯片表面形貌评定参数体系应用于工程表面粗糙度评定中,通过分析芯片表面形貌的幅值分布特征,结合芯片表面的统计特性,基于ISO 25178-2标准表征参数建立适用于芯片表面三维评定的表征参数体系.仿真结果表明:CMP加工后芯片表面形貌的幅值近似服从高斯分布;分形维数D可以准确表征芯片表面形貌,反映其复杂程度;通过幅度参数、空间参数、混合参数和分形参数建立的芯片表面形貌评定体系能够从多方面表征芯片三维表面形貌特征,对芯片表面形貌参数评定具有一定的可行性.Deficiencies of the current characterization of the surface morphology of the chip after chemical mechanical polishing,i.e.the two-dimensional contour features without the whole three-dimensional surface morphology information,and the usage of a single evaluation index to characterize the surface roughness and other issues,a scientific and comprehensive chip surface morphology evaluation parameter system was established and applied to the engineering surface roughness evaluation.By analyzing the amplitude distribution characteristics of chip surface morphology combined with the statistical characteristics of chip surface,a characterization parameter system suitable for chip surface3D evaluation was established based on ISO 25178-2 standard characterization parameters.The simulation results showed that the amplitude of chip surface topography after CMP processing approximately obeyed Gaussian distribution.Fractal dimension D accurately characterized the surface morphology of the chip and reflected its complexity.The chip surface topography evaluation system established by amplitude parameters,space parameters,mixing parameters and fractal parameters can characterize the three-dimensional surface topography characteristics of the chip from many aspects,and had certain feasibility for the evaluation of chip surface topography parameters.

关 键 词：化学机械抛光 三维表面形貌 表征参数 ISO 25178-2 分形维数 

分 类 号：TH161.14[机械工程—机械制造及自动化]