新工科视域下电子封装创新实验  

Electronic packaging experiment from the perspective of New Engineering

作　　者：吴来军 徐鸿博 李宇杰[1] 檀财旺[1] 于静泊[1] WU Laijun;XU Hongbo;LI Yujie;TAN Caiwang;YU Jingbo(School of Materials Science and Engineering,Harbin Institute of Technology(Weihai),Weihai 264209,China)

机构地区：[1]哈尔滨工业大学(威海)材料科学与工程学院,山东威海264209

出　　处：《实验室科学》2020年第6期6-9,共4页Laboratory Science

基　　金：2018年度山东省本科高校教学改革研究项目(项目编号:M2018B335)。

摘　　要：“新工科”建设开启了高等工程教育人才培养的新篇章,为高等工程教育的改革和发展提供了一个全新的视角。随着便携式电子设备的广泛应用,我国对电子封装技术专业人才的需求愈加迫切。在“新工科”建设的背景下,针对当前电子封装专业实验环节缺乏关联性以及知识框架完整性偏弱的问题,以电子产品的研发流程为参考,设计了电子封装专业创新实验。教学实践表明,该套教学体系能有效提高学生的科研兴趣和积极性,锻炼学生运用所学知识解决实际问题的能力,对学生自主学习能力、科研能力以及创新能力的培养具有重要意义。Construction of New Engineering opens a new chapter in the training of higher engineering education talents,providing a new perspective for the reform and development of higher engineering education.With the widely application of portable electronic devices,the demand for electronic packaging technology talents is growing.In the context of the construction of New Engineering,a comprehensive experiment of electronic packaging is designed in view of the lack of relevance between the current electronic packaging experiments and the weak integrity of the knowledge framework,guided by the development process of electronic product.Teaching practice shows that this set of teaching system can effectively improve students’interest and enthusiasm for scientific research and exercise the ability to use their knowledge to solve practical problems,and has positive significance for cultivating students’independent learning ability,research ability and innovative ability.

关 键 词：新工科 电子封装 实验教学 

分 类 号：G642.0[文化科学—高等教育学]