电流聚集下倒装芯片封装体应力及翘曲研究  

Study on the Stress and Warpage of Flip Chip Package Under Current Crowding

作　　者：佘陈慧 杨龙龙[1] 谈利鹏 刘培生[1,2] SHE Chenhui;YANG Longlong;TAN Lipeng;LIU Peisheng(School of Information Science and Technology,Nantong University,Nantong 226019,China;Nantong University Xinglin College,Nantong 226236,China)

机构地区：[1]南通大学信息科学技术学院,江苏南通226019 [2]南通大学杏林学院,江苏南通226236

出　　处：《南通大学学报（自然科学版）》2020年第4期42-48,共7页Journal of Nantong University(Natural Science Edition)　

基　　金：国家自然科学基金项目(61571245,61474067)。

摘　　要：为研究电流聚集对倒装芯片封装的影响,建立倒装芯片的三维封装模型,利用有限元技术对倒装芯片球栅格阵列(flip chip ball grid array,FCBGA)封装进行热-电耦合分析和热-结构耦合分析,得到倒装芯片封装体中温度分布、应力分布及位移分布。结果表明:封装最高温度出现在环氧树脂中心,封装导致芯片在电流聚集的焊料凸点处温度最高;该封装的位移都是从中心向边缘逐渐变大,最大位移位于距离中心最远的角上。In order to study the influence of current accumulation on flip chip packaging a three-dimensional package model of flip chip is built and the electro-thermal and thermal-structure couplings are analyzed with finite element technique to obtain the temperature distribution stress distribution and displacement for the flip chip ball grid array(FCBGA)package.The results show that the highest temperature appears in the center of the epoxy resin for the package and the chip has the highest temperature at the solder bumps where the current is concentrated;the displacement of the package increases from the center to the edge.The maximum displacement is at the corner furthest from the center.The findings can be applied in the FCBGA package design.

关 键 词：倒装芯片 封装 热应力 翘曲 可靠性 

分 类 号：TN604[电子电信—电路与系统]