SAW滤波器WLP封装中腔体抗模压塌陷研究  

Study on Cavity Collapse Resisting Molding Pressure in WLP of SAW Filter

作　　者：唐代华[1] 金中[1] 司美菊[1] 罗旋升 谢东峰 谢晓[1] TANG Daihua;JIN Zhong;SI Meiju;LUO Xuansheng;XIE Dongfeng;XIE Xiao(The 26th Institute of China Electronics Technology Group Corporation, Chongqing 400060, China)

机构地区：[1]中国电子科技集团公司第二十六研究所,重庆400060

出　　处：《压电与声光》2021年第1期84-87,共4页Piezoelectrics & Acoustooptics

摘　　要：通过对声表面波滤波器晶圆级封装结构的探讨,针对在模组封装时器件塌陷成因进行了有限元仿真模型研究,模拟了不同模压量对器件中腔体最大的塌陷量位置。经过实验验证,提出了一种新的金属加强结构,在3 MPa较高模压量时塌陷量几乎为0,解决了声表面波滤波器晶圆级封装芯片灌封压力导致的塌陷问题,降低了器件及模组失效风险,是一种声表面波滤波器晶圆级封装的新技术。Through discussion of the wafer level packaging structure of SAW filter,the collapse cause of the device in the module packaging is studied by the finite element simulation model,and the position of the maximum collapse of the cavity in the device with different module pressure is simulated.After practical verification,a new metal reinforced structure is proposed,which can reduce the collapse amount to almost zero at a higher mold pressure of 3 MPa,which solves the collapse problem caused by the encapsulating pressure of SAW filter wafer level packaging chip,and reduces the failure risk of devices and modules.It is a new technique of SAW filter wafer level packaging.

关 键 词：声表面波滤波器 晶圆级封装 灌封 射频前端模组 

分 类 号：TN713[电子电信—电路与系统] TM22[一般工业技术—材料科学与工程]