器件串联电阻对脉冲电流结温测试方法影响研究  

Research on Influence of Pulsed Current Junction Temperature Measurement Method by Device Series Resistance

作　　者：郑世棋[1] 李灏 翟玉卫[1] 刘岩[1] 韩伟 吴爱华[1] ZHENG Shi-qi;LI Hao;ZHAI Yu-wei;LIU Xia-mei;HAN Wei;WU Ai-hua(The 13th Research Institute China of Electronics Technology Group Corporation,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《宇航计测技术》2021年第1期38-42,共5页Journal of Astronautic Metrology and Measurement

摘　　要：半导体器件电学法结温测试过程中,校温过程同测温过程的热分布状态存在差异,导致串联电阻阻值不一致,是影响脉冲电流方法结温测试准确性的重要原因。以功率二极管为研究对象,通过搭建脉冲电流结温测量装置,对器件整体及主要串联电阻温升进行了电学测试,并利用红外测试手段进行了验证。结果显示,键合线同芯片存在显著温度差异,其串联电阻的改变会导致整体测温结果发生较大偏差。During the measurement of junction temperature by electrical method,states of thermal distribution in temperature calibration and temperature measurement are different,which lead to the inconformity of the value of series resistance,is an important factor which affects the accuracy of the pulsed current junction temperature measurement method.With power diode as research object,pulsed current junction temperature measurement system was built,and electrical measurement on the whole device temperature and series resistor temperature was conducted,which were compared with infrared testing data.Result indicates that temperatures of the bonding wires and chip are quite different,and the change of the bonding wires resistance will cause remarkable deviation in the junction temperature result.

关 键 词：电学法 结温测量 脉冲电流法 串联电阻 热分布 

分 类 号：TN313[电子电信—物理电子学]