与制程相关的盲孔互联失效案例解析  

Failure Analysis of Blind Hole Interconnection Related to Manufacturing Process

作　　者：李晓倩[1] LI Xiaoqian(CEPREI-EAST,Suzhou 215011,China)

机构地区：[1]工业和信息化部电子第五研究所华东分所,江苏苏州215011

出　　处：《电子产品可靠性与环境试验》2021年第1期39-42,共4页Electronic Product Reliability and Environmental Testing

摘　　要：盲孔作为提高多层板互联密度、减少层数和板面尺寸的有效方法,越来越多地用到普通PCB板及HDI板中。对于PCB板厂而言,通孔的制孔能力及质量是评价其制板能力的关键指标,而盲孔的制程工序相对于通孔更为复杂,某一环节控制不当均可能引发产品失效,失效隐藏较深且不可修复。从失效案例出发,分析了孔清洗不当所导致的树脂残留引发的盲孔与内层铜互联失效的问题,并通过案例说明了对接收态及热应力后的盲孔进行金相切片观察的必要性,希望能够给PCB厂商和用户提供一些参考。As an effective method to improve the interconnection density,reduce the number of layers and board size,blind holes are more and more used in general PCB and HDI board.For PCB factories,the ability and quality of through-hole is the key index to evaluate the ability of through-hole manufacturing.However,the process of blind hole manufacturing is more complex than through-hole manufacturing.Improper control of a process may lead to product failure,which is deeply hidden and irreparable.Based on the failure cases,the problem of interconnection failure between the blind hole and inner copper caused by the resin residue caused by improper hole cleaning is analyzed,and the necessity of met allograph slice observation of the blind hole after receiving state and thermal stress is illustrated through the case so as to provide some reference for PCB manufacturers and users.

关 键 词：印刷电路板 盲孔 去钻污 互联失效 

分 类 号：TN41[电子电信—微电子学与固体电子学]