真空共晶焊接金属电极片变色问题改善工艺研究  

Research on the Improvement of Discoloration of Metal Electrode in Vacuum Eutectic Soldering

作　　者：吴文辉 吴明钊 蔡约轩 王凯星 陈膺玺 WU Wenhui;WU Mingzhao;CAI Yuexuan;WANG Kaixing;CHEN Yingxi(Fujian Torch Electronic Technology Co,Ltd,Quanzhou 362300,China)

机构地区：[1]福建火炬电子科技股份有限公司,福建泉州362300

出　　处：《电子与封装》2021年第3期18-23,共6页Electronics & Packaging

摘　　要：多芯片组装共晶焊接技术是在芯片的端部和金属电极片之间添加焊料,在合适的温度、时间、真空度以及气氛下实现两表面的共晶物熔合,具有低空洞率、焊接强度高等优点。封闭的炉腔内焊料中的挥发物和氧气会造成金属电极片变色,且无法利用清洗剂去除。通过对炉腔内气氛、真空度等工艺进行试验研究,分析不同的真空度与金属电极片变色之间的关系。试验结果表明,在焊接预热阶段和焊料共晶阶段,加大真空抽气作用,将有害气体排出炉腔,可有效解决金属电极片变色现象。Eutectic soldering technology of multichip assembly by adding solder between the end of the chip and the metal electrode,the eutectic fusion of the two surfaces can be realized by proper temperature,time,vacuum degree and atmosphere.It has the advantages of low void ratio and high welding strength.Volatiles and oxygen in the solder in a closed furnace cavity can cause discoloration of the metal electrodes sheet,which can’t be removed by cleaning agent.In this paper,the relationship between the different vacuum degree and the color change of metal electrode is analyzed through the experimental research on the process of furnace chamber atmosphere and vacuum degree.The experimental results show that the discoloration of metal electrodes can be effectively solved by increasing the vacuum extraction action to discharge the harmful gas from the furnace chamber in the solder preheating stage and solder eutectic stage.

关 键 词：多芯片组装 共晶焊接 真空度 

分 类 号：TN305.94[电子电信—物理电子学]