5G天线射频插座焊点开裂问题分析  

Analysis of Soldering Joint Cracking of RF Socket of 5G Antenna

作　　者：安维[1] 曾福林[1] 沈永生 丁亭鑫 AN Wei;ZENG Fulin;SHEN Yongsheng;DING Tingxin(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China;Shengyi Electronics Co.,Ltd.,Dongguan 523000,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057 [2]生益电子股份有限公司,广东东莞523000

出　　处：《电子工艺技术》2021年第2期74-77,共4页Electronics Process Technology

摘　　要：随着5G产品的规模使用,板到板的射频信号传输应用越来越多,射频插座的焊点可靠性直接影响了信号传输的稳定性。重点针对5G天线射频插座的焊点开裂问题进行深入研究,从PCB生产方面入手,以保障射频插座的可靠性。With the large-scale use of 5G products,more and more board-to-board RF signal transmission scenarios are applied to RF sockets.The reliability of the soldering points of RF sockets directly affects the stability of signal transmission.Starting from PCB production,the soldering point cracking of the RF sockets of 5G antennas are researched in-depth to ensure the reliability of RF sockets.

关 键 词：天线 5G PCB 焊点 

分 类 号：TN605[电子电信—电路与系统]