新型HDI盲孔填孔电镀铜技术  

A New Filling Electroplating Copper Technology by HDI Blind Hole

作　　者：郝鹏飞 吕麒鹏 王殿 HAO Pengfei;Lv Qipeng;Wangdian(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《电子工业专用设备》2021年第2期33-36,共4页Equipment for Electronic Products Manufacturing

摘　　要：高密度互连(High Density Interconnect Board,HDI)印制电路板的盲孔电镀铜技术是其孔金属化实现电气互连的难点和关注重点,为此,在目前传统盲孔电镀铜技术和盲孔脉冲电镀铜技术的基础上,提出一种新型的电镀铜填孔技术,通过填孔工艺特定的镀铜添加剂,在传统盲孔电镀铜的技术上改变表面和盲孔的电流效率满足填孔要求,灵活应用于不同盲孔填充;通过试验和分析,该方法在效果、质量和成品率上均优于脉冲电镀,并可实现不同深宽比盲孔电镀铜要求,大大降低了成本。Blind hole copper plating technology of HDI printed circuit board is the difficulty and focus of its hole metallization to realize electrical interconnection.Based on the current traditional blind hole copper plating technology and blind hole pulse copper plating technology,this paper proposes a new copper plating hole filling technology,which changes the current of surface and blind hole in the traditional blind hole copper plating technology by using copper plating additives specified in the hole filling process.The efficiency meets the requirements of hole filling,and can be flexibly applied to different blind hole filling;through the test and analysis,the method is comparable to pulse electroplating in effect,quality and yield,and can realize the requirements of copper electroplating for blind holes with different thickness diameter ratio,greatly reducing the cost.

关 键 词：高密度互连板 盲孔电镀铜 添加剂 填孔 

分 类 号：TQ153.14[化学工程—电化学工业]