CMP在线光学终点检测算法研究及应用  

Research and Application of CMP In-situ Optical Endpoint Detection Algorithm

作　　者：杨元元[1] 杨旭 史霄[1] 孟晓云 杨师[1] YANG Yuanyuan;YANG Xu;SHI Xiao;MENG Xiaoyun;YANG Shi(The 45th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2021年第2期37-42,共6页Equipment for Electronic Products Manufacturing

摘　　要：介绍了化学机械抛光(CMP)中表面膜层为金属和非金属晶圆的在线终点检测原理。研究了窗口检测算法,实时检测光强变化趋势,抓取趋势特征点,从控制抛光过程,实现CMP在线终点检测。实验结果表明,检测算法可达到预期的检测精度,能够满足生产实际需要。This paper introduces the theory of in-situ endpoint detection of wafer that the surface material is metal and dioxide in chemical mechanical planarization(CMP).Window detection algorithm is studied.Endpoint detection program detects the light intensity in real time,calculates light intensity feature points,control the polishing process,and realize in-situ endpoint detection.The experimental results show that the detection algorithm could meet the prospective precision,and meet the actual production demand.

关 键 词：化学机械抛光 在线终点检测 窗口检测 算法 特征点 

分 类 号：TN305.2[电子电信—物理电子学]