电镀金锡合金的影响因素  

Factors affecting gold-tin alloy electroplating

作　　者：林玉敏[1] 彭挺[1] 戴广乾[1] 边方胜[1] LIN Yumin;PENG Ting;DAI Guangqian;BIAN Fangsheng(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电镀与涂饰》2021年第9期678-682,共5页Electroplating & Finishing

摘　　要：阐述了设备、夹具和工艺参数对金锡合金镀层成分和厚度的影响。提出利用X射线荧光检测仪分析镀层性能,并以热台辅助验证。通过合理设计夹具及调整镀液离子浓度、电流密度、电镀时间等工艺参数,可获得性能理想的金锡合金镀层。The effects of equipment,clamp,and process parameters of electroplating on the composition and thickness of Au-Sn alloy coating were discussed.It is suggested to analyze the properties of Au-Sn alloy coating using a X-ray fluorescence tester followed by hot plate testing.Au-Sn alloy coatings with favorable properties can be electroplated with a reasonably designed clamp under well-adjusted ion concentrations and current density within proper time.

关 键 词：金锡合金 电镀 厚度 元素成分 电流密度 

分 类 号：TQ153.2[化学工程—电化学工业]