合金元素和纳米颗粒对SnZn系无铅钎料影响的研究进展  

Research progress of effects of alloying elements and nanoparticles on SnZn lead-free solder

作　　者：李志豪 张亮 熊明月[1] LI Zhihao;ZHANG Liang;XIONG Mingyue(School of Mechatronic Engineering,Jiangsu Normal University,Xuzhou 221116,Jiangsu Province,China;State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]江苏师范大学机电工程学院,江苏徐州221116 [2]哈尔滨工业大学先进焊接与连接国家重点实验室,黑龙江哈尔滨150001

出　　处：《电子元件与材料》2021年第5期450-459,共10页Electronic Components And Materials

基　　金：先进焊接与连接国家重点实验室开放课题重点项目(AWJ-19Z04);江苏省“六大人才高峰”资助项目(XCL-022)。

摘　　要：在无铅钎料中,Sn-Zn共晶钎料因具有熔点与Sn-Pb共晶钎料接近、成本低、力学性能良好等优点,成为了Sn-Pb钎料的最佳替代者。但是,Sn-Zn无铅钎料因润湿性差、易氧化和抗腐蚀性差等问题严重制约其应用与发展。本文阐述了近年来国内外学者通过在Sn-Zn合金中添加合金元素与纳米颗粒来改善钎料的润湿性、抗氧化性、抗腐蚀性以及力学性能的研究成果,并且介绍了加入微量合金元素或纳米颗粒后,Sn-Zn钎料微观组织以及界面组织的变化。同时还简述了Sn-Zn钎料配套助焊剂的最新研究进展。最后,对Sn-Zn系钎料的发展趋势与前景进行了分析与展望。Among lead-free solders,Sn-Zn eutectic solder has melting point close to Sn-Pb eutectic solder.It also has low cost and good mechanical properties,which makes it the best substitute for the Sn-Pb solder.However,the Sn-Zn lead-free solders have some drawbacks,such as bad wettability and poor resistance to corrosion and oxidation,which largely restrict their application and development.As a result,it arouses great interest to modify the Sn-Zn solder by alloy and nanoparticles among scholars and institutions at home and abroad.Here this article surveys the advance in improving the wettability,oxidation and corrosion resistance and mechanical properties of Sn-Zn alloy by adding alloying elements and nanoparticles.The microstructure and interfacial structure of the Sn-Zn solder after adding alloying elements or nanoparticles are discussed.After that,the article discusses the recent research progress of the Sn-Zn solder supporting flux.Finally,the development trend and prospect of the Sn-Zn solders are envisioned,which might throw light on future research work.

关 键 词：SN-ZN 润湿性 综述 抗氧化性 微观组织 助焊剂 

分 类 号：TG425[金属学及工艺—焊接]