超声辅助对PEO-LiClO_(4)与Al阳极键合质量的影响  

Effect of Ultrasonic Assistance on the Quality of Anode Bonding for PEO-LiClO_(4) and Al

作　　者：张丽佛 刘翠荣[1] 阴旭[1] 赵为刚[1] 徐大伟 Zhang Lifo;Liu Cuirong;Yin Xu;Zhao Weigang;Xu Dawei(School of Materials Science and Engineering,Taiyuan University of Science and Technology,Taiyuan 030024,China)

机构地区：[1]太原科技大学材料科学与工程学院,太原030024

出　　处：《微纳电子技术》2021年第6期539-544,共6页Micronanoelectronic Technology

基　　金：国家自然科学基金资助项目(51875384);山西省自然科学基金资助项目(201801D121085)。

摘　　要：聚氧化乙烯-高氯酸锂(PEO-LiClO_(4))与Al的阳极键合工艺中,因键合温度较高,容易引起两者热膨胀系数不匹配、产生残余应力问题。针对这些问题,利用自主搭建的超声辅助阳极键合系统进行工艺实验,通过设计阳极键合与超声辅助键合的对比实验,进而分析键合电流和键合强度的变化趋势,从而验证超声辅助阳极键合工艺的可行性。研究结果表明:在键合电压700 V时,增加60μm超声振幅的键合峰值电流可达8.2 mA,相较于未加超声辅助时的峰值电流4.8 mA有明显提升。加超声辅助的过渡层较未加超声辅助的过渡层更厚,界面处发生电化学反应,过渡层出现新的官能团。增加超声辅助后的键合强度由4.0 MPa增强至5.9 MPa,键合强度明显提高。In the anodic bonding process of polyoxyethylene-lithium perchlorate(PEO-LiClO_(4))and Al,the high bonding temperature is easy to cause the mismatch of their thermal expansion coefficient and residual stress problem.Aiming at these problems,the self-built ultrasonic-assisted anodic bonding system was used to conduct process experiments.By designing a comparative experiment of anodic bonding and ultrasonic-assisted bonding,the change trends of bonding current and bonding strength were analyzed,then the feasibility of the ultrasonic-assisted anode bonding process was verified.The research results show that when the bonding voltage is 700 V,the bonding peak current with an increased ultrasonic amplitude of 60μm can reach 8.2 mA,which is significantly higher than the peak current of 4.8 mA without ultrasonic assistance.The transition layer with ultrasonic assistance is thicker than the transition layer without ultrasonic assistance,electrochemical reaction occurs at the interface,and new functional groups appear in the transition layer.After the addition of ultrasonic assistance,the bonding strength increases from 4.0 MPa to 5.9 MPa and is significantly improved.

关 键 词：封装 阳极键合 超声辅助 键合强度 聚氧化乙烯-高氯酸锂(PEO-LiClO_(4)) 

分 类 号：TN305.93[电子电信—物理电子学]