一种基于HTCC技术的收发组件一体化外壳  

Design of HTCC Package For T/R Module

作　　者：周昊[1] 刘海 程凯[1] ZHOU Hao;LIU Hai;CHENG Kai(Nanjing Electronic Devices Institute,Nanjing 210016,China)

机构地区：[1]南京电子器件研究所,南京210016

出　　处：《电子与封装》2021年第6期26-30,共5页Electronics & Packaging

摘　　要：设计了一款基于HTCC技术的双通道收发组件一体化外壳。在传输微波信号方面,利用HFSS软件设计射频传输通道,采用地孔优化设计和阻抗匹配的方法优化传输端口和基板内部传输线,改善外壳微波特性。测试结果显示,在10 MHz~8 GHz的范围内,射频端口和异面传输线插入损耗小于0.30 dB。在外壳结构设计方面,利用Abaqus软件优化了焊接接头,测试结果表明,外壳经过高温钎焊后的平面度不大于1.8μm/mm。This paper introduced a HTCC package for dual channel T/R module.In terms of the microwave signal transmission,the RF transmission channels were designed by using HFSS software.The package's transmission port and the transmission line were optimized by using the methods of hole optimization and impedance matching to improve the microwave characteristics.The test results showed that the insertion loss of RF ports and 3D transmission lines were less than 0.30 dB in the range of 10 MHz-8 GHz.In the design of packag's structure,the welded joints were optimized by the Abaqus software.The test results showed that the flatness of the package after high temperature brazing were less than or equal to 1.8μm/mm.

关 键 词：HTCC 外壳 收发组件 

分 类 号：TN305.94[电子电信—物理电子学]