第二相粒子改善Sn-Bi无铅焊料性能的研究现状  

Research Status of Second-phase Particles to Lmprove the Performance of Sn-Bi Lead-free Solder

作　　者：梁东成 陈东东[1] 白海龙 赵玲彦 吕金梅 徐凤仙 严继康[1] 易健宏[1] LIANG Dongcheng;CHEN Dongdong;BAI Hailong;ZHAO Lingyan;LYU Jinmei;XU Fengxian;YAN Jikang;YI Jianhong(Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China;Yunnan Tin Industry Tin Material Co.Ltd.,Kunming 650501,China)

机构地区：[1]昆明理工大学材料科学与工程学院,云南昆明650093 [2]云南锡业锡材有限公司,云南昆明650501

出　　处：《昆明理工大学学报（自然科学版）》2021年第3期27-38,共12页Journal of Kunming University of Science and Technology(Natural Science)

基　　金：国家重点研发项目(2017YFB0305700);云南省重大科技专项项目(2018ZE004)。

摘　　要：Sn-Bi焊料是目前较有潜力的低温焊料,其优异的各项性能使其广泛应用于低温焊接领域,但Sn-Bi系焊料具有易偏析、脆性大,且在服役过程中易出现相粗化以及Bi相富集,限制了其发展与应用.为克服这些弊端,国内外采用了添加第二相颗粒的方法来改善性能.通过阐述合金元素、氧化物颗粒以及碳纳米结构材料对Sn-Bi钎料熔化特性、润湿性、显微组织、界面组织及力学性能方面的影响,探讨了钎料改性工作的研究成果,简述了研究过程中存在的问题,展望了Sn-Bi系无铅焊料未来发展方向,为新型无铅焊料研发提供理论基础.Sn-Bi solder is currently a potential low-temperature solder.Its excellent properties make it widely used in the field of low-temperature soldering.However,Sn-Bi solders are easy to segregate,brittle,and are prone to phase coarseness during service.Chemical and Bi phase enrichment limit its development and application.In order to overcome these drawbacks,the method of adding second phase particles has been adopted at home and abroad to improve performance.The effects of alloying elements,oxide particles and carbon nanostructured materials on the melting characteristics,wettability,microstructure,interface structure and mechanical properties of Sn-Bi solder are mainly described.The research results of solder modification work were discussed,and finally the problems existing in the research process were briefly described,and the future development direction of Sn-Bi series lead-free solders was prospected to provide a theoretical basis for the research and development of new lead-free solders.

关 键 词：SN-BI合金 无铅焊料 增强颗粒 组织性能 钎料改性 

分 类 号：TG454[金属学及工艺—焊接]