多层瓷介电容器端电极制备工艺研究  

Preparation of terminal electrode of multilayer ceramic dielectric capacitors

作　　者：何创创 杨俊 庞锦标 徐敏 HE Chuangchuang;YANG Jun;PANG Jinbiao;XU Min(China Zhenhua Group Yunke Electronic Co.,Ltd.,Guiyang 550018,China)

机构地区：[1]中国振华集团云科电子有限公司,贵州贵阳550018

出　　处：《电子元件与材料》2021年第6期518-523,共6页Electronic Components And Materials

基　　金：国家工信部工业强基工程建设项目(0714-EMTC-02-00869);装备发展部军用电子元器件支撑科研项目(1905WM0011)。

摘　　要：为了得到小尺寸、高焊接可靠性的多层瓷介电容器,分别采用蘸浆端涂工艺和薄膜溅射工艺进行端电极制备,研究了两种端面金属化工艺的优缺点及其制备端电极的焊接可靠性。结果表明:与传统端涂工艺相比,蘸浆端涂工艺不仅彻底地摆脱了对于高精度封端设备和工装夹具的依赖,生产成本较低,而且更适用于小尺寸产品端电极的制备;同时,薄膜溅射工艺制备的端电极层具有更高的致密性,这不仅解决了端涂工艺制备端电极推球实验不合格问题,显著提高了引出端电极的焊接可靠性,而且为引出端电极层结构设计提供了多样化的解决方案,满足了用户的不同使用需求,拓宽了应用场景。In order to obtain multilayer ceramic dielectric capacitors with small size and high welding reliability,the terminal electrodes were prepared by dipping paste end coating and thin film sputtering process,respectively.The advantages and disadvantages of the two metallization processes and the welding reliability of the prepared terminal electrodes were studied.The results show that compared with the traditional end coating process,the dipping paste end coating process not only gets rid of the dependence on the high-precision end coating equipment and fixture,but also has a lower production cost,which is more suitable for the preparation of terminal electrode of small-size product.Meanwhile,the terminal electrodes prepared by thin film sputtering process has a higher density.This process improves the qualification of the terminal electrode wire bond shear test,and the terminal electrode welding reliability can be improved.Furthermore,it provides multiple solutions for the structure design of the terminal electrode layer,which meets different requirements of the users.

关 键 词：多层瓷介电容器 蘸浆端涂 薄膜溅射 端电极 焊接可靠性 

分 类 号：TM534[电气工程—电器]