高可靠塑料封装技术研究  

Research on Highly Reliable Plastic Packaging Technology

作　　者：储奕锋 周毅 陈海燕 陈波 CHU Yifeng;ZHOU Yi;CHEN Haiyan;CHEN Bo(AECC Aero Engine Control System Institute,Wuxi 214000,China)

机构地区：[1]中国航发控制系统研究所,江苏无锡214000

出　　处：《电子产品可靠性与环境试验》2021年第3期64-69,共6页Electronic Product Reliability and Environmental Testing

摘　　要：恶劣环境对塑封器件提出了高可靠性要求。介绍了塑封器件的常见失效类型,并从封装工艺角度出发,在封装材料、结构设计和封装工艺过程等方面,提出了提高塑封器件可靠性的优化方案。QFN采用半刻蚀结构、 QFP采用中岛贯通孔结构,可增加模塑料与框架的互锁强度;引线键合第二键合点采用安全弧结构,可有效地降低键合点脱落风险;模塑料与表面经棕化处理的框架结合强度更优。此外,还阐述了基板、贴片胶和模塑料的材料参数对封装可靠性的影响,芯片不同焊盘材质的耐腐蚀性优劣及键合指焊盘设计思路。The harsh environment puts forward high reliability requirements for plastic packaged devices.The common failure types of plastic of packaged devices are explained.From the perspective of packaging technology,the optimization scheme to improve the reliability of plastic packaged device is analyzed and discussed from the key aspects of packaging material,structure design and packaging process.When QFN adopts the semi-etched structure and QFP adopts the central island through-hole structure,the interlocking strength between the molding plastic and the frame can be increased.When the second bond point of lead bonding adopts a safe arc structure,the risk of falling off of the bond point can be effectively reduced.And after the molding compound and the surface are browned,the bonding strength of the frame is better.In addition,the influence of the material parameters of the substrate,SMT glue and molding compund on the reliability of the package,the corrosion resistance of the different pad materials of the chip,and the design ideas of the bonding finger pad are also explained.

关 键 词：塑封器件 封装 高可靠 

分 类 号：TN405[电子电信—微电子学与固体电子学]