混合集成技术代际及发展研究  

Research on Intergenerational and Development of Hybrid Integration Technology

作　　者：朱雨生[1,3] 施静 陈承 ZHU Yu-sheng;SHI Jing;CHEN Cheng(The 43rd Research Institute of CETC,Hefei 230088,China;PLA Army Academy of Artillery and Air Defense,Hefei 230039,China;Anhui Province Key Laboratory of Microsystem,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所,安徽合肥230088 [2]陆军炮兵防空兵学院,安徽合肥230039 [3]微系统安徽省重点实验室,安徽合肥230088

出　　处：《中国电子科学研究院学报》2021年第5期438-450,共13页Journal of China Academy of Electronics and Information Technology

基　　金：国防科工局基础科研资助项目(JCKY201910B006)。

摘　　要：混合集成技术是一种将零级封装直接组装封装为1~3级封装模块或系统,以满足航空、航天、电子及武器装备对产品体积小、重量轻、功能强、可靠性高、频率宽、精密度高、稳定性好需求的高端封装技术。从二十世纪七十年代至今,混合集成技术历经了从厚薄膜组装到多芯片组件(MCM)、系统级封装(SiP)、微系统集成等阶段。它始终专注于微观器件与宏观器件的联结,是一种融合设计、材料、工艺、工程、实验的多学科持续创新技术;文中通过分析研究不同时期混合集成技术的工艺特征、技术要点和典型产品,归纳与总结首次提出混合集成技术代际划分,同时根据不同代际的技术特征与趋势,对下一代混合集成技术的发展方向进行预测。Hybrid integration technology is a kind of high-end packaging technology that directly encapsulates zero level devices into 1~3 level modules or systems to meet the requirements of small volume,light weight,strong function,high reliability,wide frequency,high precision and good stability for aerospace,electronic and weapon equipment.Since the 1970s,hybrid integration technology has gone through the stages from thick/thin film assembly to multi chip module(MCM),system level packaging(SIP),micro system integration and so on.It always focuses on the connection between micro-and macro-devices,which is a continuous innovation technology of multi-disciplinary integration for design、material、technics、project、experiment.In this paper,by analyzing and studying the process characteristics,key points and typical products of hybrid integration technology in different periods,the development of hybrid integration technology is divided into four generations by induction and summary.Meanwhile,according to the technical characteristics and trends of different generations,it also tries to predict the development direction of the next generation of hybrid integration technology.

关 键 词：混合集成电路 混合集成技术 厚薄膜工艺 微系统 代际 

分 类 号：TN452[电子电信—微电子学与固体电子学]