异构集成芯片关键技术研究  

Research on Key Technologies of Heterogeneous Integrated Chip

作　　者：钟伟军 任翔[1] 赵鑫[1] 

机构地区：[1]中国电子技术标准化研究院

出　　处：《信息技术与标准化》2021年第7期6-10,共5页Information Technology & Standardization

摘　　要：分析了Chiplet异构集成芯片技术及其发展现状。重点研究了内部总线互连和先进封装两个构建异构集成芯片的关键技术,简要介绍了这两个关键技术的标准化情况。通过对异构集成芯片技术发展趋势的分析,提出了现阶段在国内大力发展Chiplet并制定相关技术标准的重要性和迫切性。The technical and current development status of heterogeneous integrated chiplet based on chip are analyzed in this paper.This paper focuses on two key technologies,internal bus interconnection and advanced packaging,which are used to build heterogeneous integrated chips,and combs the standardization of these two key technologies.Based on the analysis of the development trend of heterogeneous integrated chip technology,the importance and urgency of developing chiplet technology and formulating relevant technical standards in China are proposed.

关 键 词：异构集成 小芯片 串行器和解串器 总线互连 先进封装 

分 类 号：TN40[电子电信—微电子学与固体电子学]