浅谈大功率LED陶瓷基板制作工艺及填通孔技术  

Discussion on manufacturing process and through-hole filling technology of ceramic substrate applied to high-powered LEDs

作　　者：谢金平 范小玲 宗高亮 XIE Jinping;FAN Xiaoling;ZONG Gaoliang(Guangdong Intensive Ecotech Co.,Ltd.,Foshan 528200,China)

机构地区：[1]广东致卓环保科技有限公司,广东佛山528200

出　　处：《电镀与涂饰》2021年第13期1023-1026,共4页Electroplating & Finishing

摘　　要：介绍了将直接镀铜工艺和填通孔技术相结合制备大功率LED(发光二极管)陶瓷基板的工艺流程,重点介绍了采用直流电镀一步法、脉冲电镀一步法和脉冲电镀两步法填通孔的常用配方和填充效果。The process flow for manufacturing ceramic substrate used on high-powered LEDs(light-emitting diodes)by combination of direct copper plating and through hole filling was introduced.The common bath compositions and filling effectiveness of different through hole filling technologies i.e.one-step direct-current plating,one-step pulse-reverse plating,and two-step pulsed plating were described.

关 键 词：大功率发光二极管 陶瓷基板 填通孔 电镀铜 直流 脉冲电流 

分 类 号：TQ153.14[化学工程—电化学工业]