微波覆铜板抗辐照性能评估方法  

Radiation Resistance Evaluation Method of Microwave Cooper Clad Lamination

作　　者：林玉敏[1] 边方胜[1] 卢军 LIN Yumin;BIAN Fangsheng;LU Jun(The 29th Research Institute of CETC,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,四川成都610036

出　　处：《电子工艺技术》2021年第3期134-137,共4页Electronics Process Technology

摘　　要：宇宙空间辐射产生的高能粒子会对有机高分子材料的印制电路板产生损伤,使材料电学性能和物理性能发生变化,造成卫星电子系统失效,因此抗辐照性能是星载产品不可或缺的实验项目。对微波覆铜板进行抗辐照试验后,从材料失重、电阻率、介电常数等多方面进行评估,得到辐照总剂量与材料性能变化之间的关系。在星载产品设计阶段,根据卫星运行的轨道高度及印制电路板使用位置进行材料型号的选择。The printed circuit board which is organic polymer material can be damaged by the high-energy particles produced by space radiation.The satellite may be in trouble because the electrical property and physical property have been changed.So radiation resistance test is necessary for the space product.The weight loss,resistivity,dielectric constant and so on are evaluated after radiation resistance test.The relation between the variation of the material property and radiation dosage can be gotten.In the design stage of space products,the material model should be chosen according to the orbit altitude and the position PCB used.

关 键 词：覆铜板 辐照 失重 介电常数 

分 类 号：TN606[电子电信—电路与系统]