高可靠性微电子装备用焊膏理-化性能摸底试验  

Physical and Chemical Properties Test of Solder Paste with High Reliability for Microelectronic Equipment

作　　者：张莹洁 郑冰洁 赖春潮 刘子莲[1] 罗道军[1] ZHANG Yingjie;ZHENG Bingjie;LAI Chunchao;LIU Zilian;LUO Daojun(The 5th Research Institute of MII,Guangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子工艺技术》2021年第3期178-181,共4页Electronics Process Technology

摘　　要：介绍了“国内高可靠性微电子装备用焊膏”研制工程第一阶段的部分工作,即对国外的三款无铅焊膏和两款有铅焊膏的共计19个项目的材料理化性能进行摸底试验,主要包括焊膏的金属部分性能、助焊膏部分性能和焊膏整体性能,并将试验数据汇总统计和分析,研究不同品牌焊膏的各项理化性能,旨在全面摸清国外知名品牌焊膏的理化性能水平和差异。同时,为高可靠性微电子工艺用焊膏的性能检测提供了方法。The part of the work in the first stage of research and development of domestic solder paste with high reliability for microelectronic equipment is introduced.The physical and chemical properties of 19 items of the solder pastes are tested,including three lead-free solder pastes and two lead solder pastes of foreign brands.The performance of the metal part,the soldering fl ux and the solder paste have been tested and studied.Then,the research data are summarized and analyzed to refl ect the performance differences of solder pastes.Ultimately,the physical and chemical properties of solder pastes of foreign brands could be clarified.At the same time,it provides a method for testing the performance of high reliability solder paste for microelectronic process.

关 键 词：微电子装备 焊膏 理化性能 可靠性 

分 类 号：TN606[电子电信—电路与系统]