微混装焊料组织及力学性能研究进展  

Research Progress on Microstructures and Mechanical Properties of Composite Solder

作　　者：张尚 张墅野[1] 何鹏[1] ZHANG Shang;ZHANG Shuye;HE Peng(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001

出　　处：《电子与封装》2021年第8期1-11,共11页Electronics & Packaging

基　　金：中央高校基本科研业务费专项资金(AUGA5710051221);国家重点研发计划(2019YFF0217402);国家自然科学基金(51805115);中国博士后科学基金(2019M651280)。

摘　　要：随着电子封装技术的快速发展,封装密度不断提高,焊点尺寸越来越小,焊接工艺窗口变窄,现今最常用的Sn-Ag-Cu焊料的性能越发难以满足先进封装技术的需求。以Sn-Ag-Cu焊料为基础进行微混装改性以提升其性能是现今电子封装用焊料研究的一个重要方向。从微合金化、增强相颗粒掺杂和多焊料超结构3种微混装方式综述微混装焊料的混装形式、改性机理和性能提升等方面的研究进展,同时对这几种混装方式的优劣势进行对比,介绍微混装研究的热点方向。With the rapid development of electronic packaging technology,the packaging density continues to increase,the size of solder joints is getting smaller,and the soldering process window is narrowing.The performance of the most commonly used Sn-Ag-Cu solder today is becoming more and more difficult to meet the needs of advanced packaging technology.Improving the performance by micro-mixing modification based on Sn-Ag-Cu solder is an important research direction of solders for electronic packaging.The research progress of micro-mixed solder's mixing form,modification mechanism and performance improvement from three micro-mixed methods of microalloying,enhanced phase particle doping,and multi-solder superstructure is summarized.The advantages and disadvantages of mixed packaging methods are compared,and the hot research directions of micro-mixed packaging are introduced.

关 键 词：先进封装 微合金化 增强相颗粒 多焊料超结构 

分 类 号：TN305.94[电子电信—物理电子学] TG425[金属学及工艺—焊接]