CBGA器件焊接工艺与焊点失效分析  

Soldering Technology of CBGA Devices and the Failure Analysis of the Solder Point

作　　者：李苗 孙晓伟[1] 宋惠东 程明生[1] LI Miao;SUN Xiaowei;SONG Huidong;CHENG Mingsheng(China Electronics Technology Group Corporation No.38 Research Institute,Hefei 230031,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,合肥230031

出　　处：《电子与封装》2021年第8期22-28,共7页Electronics & Packaging

摘　　要：陶瓷球栅阵列(CBGA)封装由于其优异的电性能和气密性等优点而被广泛应用于军事、航空和航天电子制造领域中。CBGA陶瓷基板与印制电路板(PCB)之间的热失配一直是CBGA封装可靠性研究主要关心的问题。对CBGA器件装配工艺进行研究,并对焊点在温度循环(-55~+100℃)和随机振动条件下的失效机理进行分析。结果表明,焊点在温度循环和随机振动等综合应力作用下发生开裂,器件四角处的焊点最先发生开裂,开裂位置为焊料与陶瓷器件焊盘接触位置。温度循环试验后CBGA器件焊点形成的IMC层厚度略有增加。Ceramic ball grid array(CBGA)package is widely used in military,aerospace and aerospace electronics manufacturing fields due to its excellent electrical properties and air tightness.The thermal mismatch between the CBGA ceramic substrate and the printed circuit board(PCB)has always been the main concern of CBGA package reliability research.This paper studied the assembly process of CBGA devices and analyzed the failure mechanism of solder joints under temperature cycling(-55-+100℃)and random vibration.The results showed that the solder joint cracked under the combined stress of temperature cycling and random vibration.The solder joints at the four corners of the device were the first to crack.After the temperature cycle test,the IMC layer formed by the solder joint of the CBGA device increased slightly.

关 键 词：CBGA 焊接工艺 热失配 可靠性 

分 类 号：TN305.94[电子电信—物理电子学]