硅基微流道高效散热技术在宽带微波收发组件中的应用  

Application of Silicon-Based Microchannel High Efficiency Heat Dissipation Technology in Broadband Microwave Transceiver Module

作　　者：向伟玮[1] 张剑 卢茜[1] 李阳阳[1] 董乐[1] XIANG Weiwei;ZHANG Jian;LU Qian;LI Yangyang;DONG Le(The 29th Research Institute of China Electronics Technology Group Corporation,Chengdu 610036,China)

机构地区：[1]中国电子科技集团公司第二十九研究所,成都610036

出　　处：《电子与封装》2021年第8期99-102,共4页Electronics & Packaging

摘　　要：硅基微流道散热技术可以实现每平方厘米数百瓦的高效散热能力。开发了硅基微流道散热器,实现了600 W/cm2以上的高效散热能力。硅作为半导体材料,会影响微波功率芯片的接地性能。通过对硅基微流道散热器进行整体金属化处理,可使其满足宽带微波收发组件的应用要求。将硅基微流道散热器集成在大功率收发组件中,在2~6 GHz的频率范围内,组件能够正常工作,饱和输出功率大于40 dBm。Silicon-based microchannel heat dissipation technology can achieve efficient cooling capacity of hundreds of watts per square centimeter.Silicon-based microchannel radiator which can realize the cooling capacity of more than 600 W/cm2 is fabricated.As semiconductor material,the parasitic effect of silicon will affect the grounding performance of microwave power chips.After integral metallization,the silicon microchannel radiator can meet the application requirements of broadband microwave transceiver module.Furthermore,silicon-based microchannel radiator is integrated into a high-power transceiver module.In the frequency range of 2-6 GHz,the module can work normally,and the saturated output power is more than 40 dBm.

关 键 词：硅基微流道 高效散热 宽带微波 

分 类 号：TN454[电子电信—微电子学与固体电子学]