金-锡合金电镀液的研究进展  

Progress in research of gold-tin alloy electroplating bath

作　　者：黄明亮[1] 阎艳 黄斐斐 方超 HUANG Mingliang;YAN Yan;HUANG Feifei;FANG Chao(Electronic Packaging Materials Laboratory,School of Materials Science and Engineering,Dalian University of Technology,Dalian 116024,China)

机构地区：[1]大连理工大学材料科学与工程学院先进连接技术辽宁省重点实验室,辽宁大连116024

出　　处：《电镀与涂饰》2021年第15期1187-1192,共6页Electroplating & Finishing

基　　金：国家自然科学基金(U1837208,51671046);中央高校基本科研业务费项目(DUT20LAB122)。

摘　　要：介绍了氰化物体系和无氰体系(包括氯化物体系、亚硫酸盐体系、乙内酰脲体系)Au-Sn合金电镀液的研究现状,分析了各自的特点和不稳定的原因,重点阐述了提高不同体系Au-Sn合金电镀液稳定性的方法,展望了Au-Sn合金电镀液的发展。The progress in research of cyanide-based and cyanide-free baths including chloride,sulfite,and hydantoin-based electrolytes for electroplating Au-Sn alloy were introduced.Their characteristics and instability reasons were analyzed.The methods to improve the stability of bath for electroplating Au-Sn alloy were described.The future development of Au-Sn alloy electroplating bath was prospected.

关 键 词：金−锡合金 电镀 氰化物 无氰镀液 稳定性 综述 

分 类 号：TQ153.2[化学工程—电化学工业]