图形电镀高厚径比板孔内无铜的原因分析  

Analysis on the cause of hole void with high aspect ratio board in pattern plating process

作　　者：李仕武 谢明运 王景贵 Li Shiwu;Xie Mingyun;Wang Jinggui(Huizhou China Eagle Electronic Technology Co.,Ltd,Huizhou Guangdong,Postal Code519029)

机构地区：[1]广州广合科技股份有限公司品质部,广东广州510730 [2]广州广合科技股份有限公司,广东广州510730

出　　处：《印制电路信息》2021年第8期28-33,共6页Printed Circuit Information

摘　　要：孔内无铜是图形电镀流程的常见报废缺陷,漏检到客户处经高温焊接之后产生孔内开路失效的风险很高。本文通过对一款高厚径比板的孔内无铜问题进行系统分析,识别产生原因,并有效解决问题。Hole void is a common scrap defect in pattern plating process.there is a high risk of hole open failure after the customer welded at high temperature.In this paper,through the analysis of the hole void with a high aspect ratio board,the cause was identified and the problem was effectively solved.

关 键 词：图形电镀 高厚径比 孔内无铜 

分 类 号：TN41[电子电信—微电子学与固体电子学]