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作 者:王香芬[1] 邢润家 WANG Xiangfen;XING Runjia(School of Reliability and System Engineering,Beihang University,Beijing 100191,China)
机构地区:[1]北京航空航天大学可靠性与系统工程学院,北京100191
出 处:《电子产品可靠性与环境试验》2021年第4期44-49,共6页Electronic Product Reliability and Environmental Testing
摘 要:光电耦合器作为单向传输与隔离器件在航空航天领域得到大量的应用。由于光电耦合器具有缺陷隐蔽特征,其在筛选时不会被激发出来,而在使用中却会被不断地激发而导致加速失效,产生类似外部环境和应力造成的失效现象。为了确定常见光耦内部缺陷的存在性、类型和相关失效机理,总结了键合点颈缩处断路或虚接、芯片粘结失效、钝化层破损3种常见的微观缺陷,分别讨论了相关的失效模式和失效机理。采用由外部到内部、由宏观到微观的存在微观缺陷的光电耦合器的失效分析方法分析了相关失效案例。分析结果表明,封装材料不匹配所导致的微观缺陷应在选材和设计阶段加以预防,芯片贴接、钝化层破损等制造缺陷应通过制造阶段的规范加以规避。这对其他存在微观缺陷的半导体器件失效分析也有一定的借鉴作用。Optical coupler are widely used in the field of aerospace as unidirectional transmission and isolation devices.Because the defects of the optical coupler are concealed,they are not excited during screening,but are continuously excited during use,which leads to accelerated failure,and the causes the failure phenomenon caused by external environment and stress.In order to determine the existence,types and related failure mechanisms of common optical coupler internal defects,three common microscopic defects,namely open or virtual connection at the necking of the bonding point,chip bonding failure,and passivation layer damage,are summarized,and the related failure modes and failure mechanisms are discussed separately.The failure analysis methods of optical couplers with micro-defects from the outside to the inside and from the macro to the micro are used to analyze relevant failure cases.The analysis results show that the micro-defects caused by the mismatch of packaging materials should be prevented in the material selection and design stage,and the manufacturing defects such as chip attachment and passivation layer damage should be avoided through the specifications of the manufacturing stage,which is also a reference for the failure analysis of other semiconductor devices with microscopic defects.
关 键 词:光电耦合器 微观缺陷 失效分析 失效模式 失效机理 键合点 钝化层 制造缺陷
分 类 号:TN622[电子电信—电路与系统]
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