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作 者:张银婵 牛新环 周佳凯 杨程辉 冯子璇 常津睿 侯子阳 朱烨博 ZHANG Yin-chan;NIU Xin-huan;ZHOU Jia-kai;YANG Cheng-hui;FENG Zi-xuan;CHANG Jin-rui;HOU Zi-yang;ZHU Ye-bo(School of Electronic and Information Engineering,Hebei University of Technology,Tianjin 300130,China;Tianjin Key Laboratory of Electronic Materials and Devices,Tianjin 300130,China)
机构地区:[1]河北工业大学电子信息工程学院,天津300130 [2]天津市电子材料与器件重点实验室,天津300130
出 处:《应用化工》2021年第8期2249-2253,共5页Applied Chemical Industry
基 金:国家02重大专项(2016ZX02301003-004_007);天津市自然科学基金(16JCYBJC16100,18JCTPJC57000)。
摘 要:首先介绍了甘氨酸的基本性质,接着回顾了近年来国内外甘氨酸在集成电路多层布线及其它材料CMP中的不同应用,归纳总结表明甘氨酸在CMP过程中可以起到络合、缓蚀、控制电偶腐蚀、催化等多种作用,具有宽泛的应用领域,最后对氨基酸类的添加剂在CMP中的应用前景进行了展望。The basic properties of glycine are introduced firstly,and then the different applications of glycine in the multi-layer wiring technology applied in integrated circuit and the CMP process of other materials at home and abroad in recent years are reviewed.It is concluded that glycine can achieve a variety of functions in the CMP process,including the complexation,corrosion inhibition,galvanic corrosion control,and catalysis,which has a wide range of application fields.Finally,the application prospect of amino acid additives in the CMP process is prospected.
分 类 号:TQ421.4[化学工程] TN305.2[电子电信—物理电子学]
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