Cu-Sn-Cu互连微凸点热压键合研究  

Study of Cu-Sn-Cu Interconnection Using Thermal Compression Flip Chip Bonding

作　　者：张潇睿 ZHANG Xiaorui(Aviation Engineering College,Civil Aviation Flight University of China,Guanghan 618307,China)

机构地区：[1]中国民用航空飞行学院航空工程学院,四川广汉618307

出　　处：《电子与封装》2021年第9期20-24,共5页Electronics & Packaging

摘　　要：随着多数产品更高的I/O数需求,微铜柱凸点已经成为倒装芯片领域的主流,而热压倒装焊则是目前使用最多的键合方式之一。针对一款Cu-Sn-Cu倒装芯片,基于日本Athlete公司的CB-600低荷重半自动倒装键合机,以研究芯片键合质量为目标,完成了不同参数条件下的芯片键合样品,并通过光学显微镜和拉剪力测试机对样品的键合质量进行了比较,得到了键合参数对键合质量的影响规律。With the increasing demand of more I/O in most products,micro copper pillar solder bump has become the mainstream of flip chip field,and thermal compression bonding is one of the most widely used bonding methods.This paper focuses on Cu-Sn-Cu flip chip,and aims at the quality of chip bonding,the samples with different parameters are completed by using CB-600 of Athlete in Japan.The bonding quality of the samples is compared by optical microscope and tensile shear tester,and the influence of bonding parameters on bonding quality is obtained.

关 键 词：微铜柱凸点 热压键合 键合参数 拉剪力测试 

分 类 号：TN305.94[电子电信—物理电子学]