基于正交法的50μm LTCC精细线条工艺研究  

Study of 50μm LTCC Fine-Line Technology Based on Orthogonal Experiment Method

作　　者：段龙帆 卢会湘[1,2] 刘瑶 严英占 DUAN Longfan;LU Huixiang;LIU Yao;YAN Yingzhan(The 54th Research Institute of CETC,Shijiazhuang 050081,China;China Communication System Co.,Ltd.,Hebei Branch,Shijiazhuang 050081,China;Hebei Noah Human Resource Development Co.,Ltd.,Shijiazhuang 050035,China)

机构地区：[1]中国电子科技集团公司第五十四研究所,石家庄050081 [2]中华通信系统有限责任公司河北分公司,石家庄050081 [3]河北诺亚人力资源开发有限公司,石家庄050035

出　　处：《电子与封装》2021年第9期43-46,共4页Electronics & Packaging

摘　　要：通信装备的集成化和小型化,对低温共烧陶瓷(LTCC)基板集成度和精度提出了更高的要求,互连通孔和基板线条也由原来的100μm需要缩小到50μm。由于国内常规LTCC电路可实现的最细线条宽度一般在100μm左右,为了提高工艺能力,有必要对影响线条精度的关键参数开展正交试验。通过对各影响因素进行分析,最终确定了优化后的工艺参数,掌握基于50μm精细高集成LTCC基板技术,并成功将其拓展于实际产品加工中,对LTCC基板电路加工具有一定的参考价值。The integration and miniaturization of communication equipment puts require the higher integration and fabrication precision on low-temperature co-fired ceramic(LTCC).Specifically,the precision of vias and the signal lines should be reduced to 50μm from the traditional 100μm.Since the line accuracy can be achieved by the domestic conventional LTCC circuit is generally about 100μm,in order to improve the process capability,orthogonal experiments for these key parameters are carried out.And through analyzing these influencing factors,the optimized process parameters are determined.Based on the improved technology on 50μm higher precision,the engineering products are developed,which have important implications for LTCC technology application.

关 键 词：LTCC基板 丝网印刷 离网间距 印刷速度 

分 类 号：TN405.97[电子电信—微电子学与固体电子学]