非真空制冷型红外探测器小型化封装技术  

Miniaturization Packaging Technology of Non-Vacuum Cooled Infrared Detector

作　　者：方志浩 张磊[1] 付志凯 刘森[1] FANG Zhi-hao;ZHANG Lei;FU Zhi-kai;LIU Sen(North China Research Institute of Electro-optics,Beijing 100015, China)

机构地区：[1]华北光电技术研究所,北京100015

出　　处：《红外》2021年第9期21-25,共5页Infrared

摘　　要：基于红外探测系统对小体积制冷型红外探测器的应用需求,提出了一种新型非真空制冷型红外探测器小型化封装技术。阐述了其结构和工艺设计要点,实现了组件封装并通过耦合J--T制冷器进行了相关性能测试。结果表明,本文所述的设计方案可实现128×128元(15 m)InSb芯片封装,组件尺寸小于等于Φ20 mm×15 mm,重量约为5 g,性能比现有产品显著提升,探测成像性能可以满足使用要求。该组件的启动时间可达到4 s以内,蓄冷时间目前为6 s,制冷性能在后续研究中联合制冷器设计可以得到进一步优化。Based on the application requirements of infrared detection systems for small-volume cooled infrared detectors,a new type of non-vacuum cooled infrared detector miniaturization packaging technology is proposed.The key points of its structure and process design are explained,the component packaging is realized,and the performance test of the coupled J-T refrigerator is carried out.The results show that the design scheme described in this article can achieve 128×128(15m)InSb chip packaging,the components are less than or equal toΦ20 mm×15 mm,the weight is about 5 g,and the performance is significantly improved compared with existing products.Its detection and imaging performance can meet the requirements of use.The start-up time of this component can be less than 4 s,and the cold storage time is currently 6 s.The refrigeration performance can be further optimized and improved in the follow-up study of the joint refrigerator design.

关 键 词：非真空 红外探测器 小型化 封装技术 

分 类 号：TN215[电子电信—物理电子学]