PTFE板材烘板后剥离强度衰减原因分析及改善方法  

Analysis and improvements of peel strength failure occurs after baking the PTFE material

作　　者：周轶人 张华[1] 杨涛[1] 黄伟壮[1] 王灿满 Zhou Yiren;Zhang Hua;Yang Tao;Huang Weizhuang;Wang Canman

机构地区：[1]广东生益科技股份有限公司,广东东莞523000

出　　处：《印制电路信息》2021年第10期26-28,共3页Printed Circuit Information

摘　　要：印制电路板加工过程中需要采用烘板工艺解决水分对产品的影响,但使用聚四氟乙烯基材生产时,高温烘板(200℃/1 h)后存在剥离强度失效问题。经过考察确定原因为:与基材结合的铜箔处理剂在高温下容易被氧化并失效,从而导致板材剥离强度衰减严重。PCB baking process is needed to solve moisture influence on the product.However,the author found that there are possibility that the Peel Strength will be failed when the company uses high temperature(200℃/1 h)to bake the PTFE material.Based on the careful investigation,the reason is determined as follows:the copper foil treatment agent with good combination with PTFE is easy to be oxidized and fail at high temperature,resulting in serious degradation of peel strength.

关 键 词：聚四氟乙烯基材 烘板 氧化 剥离强度 

分 类 号：TN41[电子电信—微电子学与固体电子学]