覆铜板表面树脂层厚度测量方法  

Measurement method of CCL surface resin layer thickness

作　　者：尹建洪[1] 叶锦荣[1] Yin Jianhong;Ye Jinrong

机构地区：[1]广东生益科技股份有限公司,广东东莞523039

出　　处：《印制电路信息》2021年第10期29-32,共4页Printed Circuit Information

摘　　要：覆铜板或印制电路板基材的表面树脂层,其厚度可能会一定程度上影响覆铜板或印制板的相关基材特性或绝缘可靠性。文章在常规垂直切片的基础上,通过优化预制样方式并结合样品评估和验证,确认较为简便的获得表面树脂层厚度的测量方法,避免传统垂直切片因研磨位置的差异导致数据波动而不够准确的缺点。For the surface resin layer on copper clad laminate(CCL)or printed circuit board(PWB),the thickness of surface resin layer may affect the relevant material properties or reliability of copper clad laminate and printed circuit board to some extent.In this paper,the selective sampling is optimized based on the conventional method of cross section,a relatively simple measuring method of surface resin layer thickness is obtained,so as to avoid the weakness of inaccuracy due to thickness fluctuation caused by different grinding positions of conventional section sampling.

关 键 词：覆铜板 表面树脂层 奶油层 

分 类 号：TN41[电子电信—微电子学与固体电子学]