一种机载模块中的刚挠结合板的研制  

Development of the Rigid-flex PCB Used in Airborne Modules

作　　者：邹嘉佳[1] 徐光跃 孙晓伟[1] 赵丹[1] ZOU Jia-jia;XU Guang-yue;SUN Xiao-wei;ZHAO Dan(No.38Research Institute of CETC,Hefei 230031,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230031

出　　处：《混合微电子技术》2020年第3期66-68,79,共4页Hybrid Microelectronics Technology

摘　　要：采用刚挠结合板代替现有的线缆互联,实现机载组件中的内部信号传输。通过对对刚挠结合板进行材料选择、结构设计、制造工艺和装配过程的研究,成功在组件内实现刚挠结合板对线缆的功能替代,并发挥了薄型化、轻量化的优势,解决了线缆过厚带来的装配问题,并通过电讯和环境试验验证,为组件内和组件间的柔性互联技术革新提供了思路。Replacing the cable interconnection with rigid-flex PCB to transfer the unit internal single for airborne electronic device,it is an effective method to solve the problem of messy interconnection,difficulty assembly and testing.Material choices,construction design,manufacture process control and electronic assembly of rigid-flex PC Bare studied to get substitution for wires.The results show that the down-converter used with rigid-flex PCB pass the environmental andelectrictests.

关 键 词：刚挠结合板 导线 下变频组件 材料 装配 

分 类 号：TN405[电子电信—微电子学与固体电子学]