一种面向碱金属气室的Si-Glass激光键合有限元仿真分析  

Research on laser assisted anodic bonding technology for chip-level atomic clock MEMS vapor cells

作　　者：王锦曦 罗云霞 郭京 华尔天 闫树斌 WANG Jinxi;LUO Yunxia;GUO Jing;HUA Ertian;YAN Shubin(School of Instrument and Electronics,North University of China,Taiyuan 030051,China;School of electrical engineering,Zhejiang Uiuversity of Water Resources and Electric Power,Hangzhou 310018,China;School of electrical and control engineering,North University of China,Taiyuan 030051,China)

机构地区：[1]中北大学,仪器与电子学院,太原030051 [2]浙江水利水电学院,电气工程学院,杭州310018 [3]中北大学,电气与控制工程学院,太原030051

出　　处：《自动化与仪器仪表》2021年第10期203-208,共6页Automation & Instrumentation

基　　金：科技部国家重点研发计划(No.2017YFB0503200);国家自然科学基金(No.61975189,No.61675185)资助。

摘　　要：随着MEMS封装元器件向着结构复杂化、功能多样化、器件微型化发展,在保持器件微结构形貌的基础上,对样本的键合强度有着更高的要求。采用有限元分析软件ANSYS V18.2对Si-Glass激光键合工艺进行了有限元分析法(Finite Element Method, FEM)仿真和工艺实现、试验研究、测试表征。以二维面的热源加载传热解析模型为理论基础,采用温度场仿真分析研究了20 W~48 W这个激光功率区间内激光键合的三维温度场分布,结合实验数据分析预测了阈值功率在28 W左右。对实验样品进行气密性测试,结果表明:激光键合样品气密性测试的平均泄漏率约为10.48×10^(-9) Pa·m3/s,符合GB/T 4937.22-2018中相关标准的规定。采用能谱分析(Energy Dispersive Spectroscopy, EDS)扫描Si-Glass激光键合的界面材料成分初步验证了Si-Glass激光键合技术具有选择性以及局部键合的优势,验证模型的正确性,且可应用于MEMS的其他工程材料的键合环节中。With the development of MEMS packaging components, MEMS is becoming more and more prominent in the direction of miniaturization, complicated structure and diversified functions. There are higher requirements for the bonding strength of the samples. In this paper, FEM software ANSYS V18.2 is used to simulate, product complete, experimental research, testing and characterization of Si-Glass laser anode bonding. Based on the theoretical heat transfer two-dimensional(2 D) model, the temperature field simulation analysis is used to study the three-dimensional(3 D) temperature field distribution of laser bonding in the laser power range of 20 W~48 W. The airtightness test of the experimental samples shows that the average leakage rate of the airtightness test of the laser bonded samples is about 10.48×10^(-9)Pa·m3/s, comply with the requirements of related standards in GB/T 4937.22-2018. Using Energy Dispersive Spectroscopy(EDS) to scan the interface material composition of Si-Glass laser anodic bonding is basically consistent with the simulation results, which also verifies the correctness of the model and it can be applied to the bonding process of MEMS engineering materials.

关 键 词：微机电系统 ANSYS软件 有限元分析 键合强度 原子气室 

分 类 号：TP202[自动化与计算机技术—检测技术与自动化装置] O242.21[自动化与计算机技术—控制科学与工程]