压电喷墨腔室键合工艺的研究  

Research on Bonding Process of Piezoelectric Inkjet Chamber

作　　者：王凤伟 孟令凤 宛瑛泽 邹赫麟[1] Wang Fengwei;Meng Lingfeng;Wan Yingze;Zou Helin(School of Mechanical Engineering,Dalian University of Technology,Dalian,Liaoning 116024,China)

机构地区：[1]大连理工大学机械工程学院,辽宁大连116024

出　　处：《机电工程技术》2021年第10期15-19,共5页Mechanical & Electrical Engineering Technology

摘　　要：描述了一种结合光刻和热键合工艺制作压电喷墨腔室的工艺方法,并对喷墨腔室的键合质量进行研究。首先在Si基底上制作完全交联的SU-8开放腔室,然后在PDMS基底上采用邻近式紫外曝光得到带有锥形喷孔的喷孔板,最后将喷孔板与开放腔室热键合得到一体化的喷墨腔室。通过控制曝光量来得到不同交联程度的喷孔板,测量不同交联程度下喷墨腔室的键合强度;通过优化氧等离子体处理工艺参数,提高了喷墨腔室的键合强度;此外,优化了热键合温度和键合时间,获得最小的腔室变形量。A method for fabricating piezoelectric inkjet chamber by combining photolithography and thermal bonding was described and the bonding quality of the chamber was studied.A fully cross-linked SU-8 open chamber was made on Si substrate,then a conical orifice plate was obtained on PDMS substrate by using adjacent UV exposure.Finally,an integrated inkjet chamber was obtained by thermal bonding the orifice plate with the open chamber.The orifice plates with different degree of cross-linking were obtained by controlling the exposure,and the bonding strength of the inkjet chamber was measured.The bonding strength of the inkjet chamber was improved by optimizing the process parameters of oxygen plasma treatment.In addition,the bonding temperature and time were optimized to obtain the minimum deformation of the chamber.

关 键 词：喷墨腔室 曝光量 键合强度 氧等离子体 

分 类 号：TP334.8[自动化与计算机技术—计算机系统结构]