热时效条件下倒装焊点失效的有限元模拟  

Finite element simulation of failure of flip chip solder joint under thermal aging conditions

作　　者：李志强 王玉霞 LI Zhi-qiang;WANG Yu-xia(Qinghai Higher Vocational&Technical Institute,Haidong 810700,Qinghai pro.,China)

机构地区：[1]青海高等职业技术学院,青海海东810799

出　　处：《焊接技术》2021年第10期84-87,I0012,共5页Welding Technology

摘　　要：PBGA封装体由多种热膨胀系数不同的材料组成,在热循环过程中易固封装体材料间的热失配导致倒装焊点失效。利用Ansys有限元模拟软件,建立PBGA封装体有限元模型,通过选取材料参数、有限元单元、施加载荷及计算,研究封装体中倒装焊点在时效温度为150℃、时间为500 h条件下的应变及位移,并利用能量法从累积塑性应变和累积塑性应变能角度,分析焊点失效情况。结果表明,封装体中,边角焊点所承受的应力、应变、累积塑性应变、累积塑性应变能最大,边角焊点为最易失效焊点。The PBGA package body was composed of a variety of materials with different thermal expansion coefficients. During thermal cycling, it was easy to cause the flip-chip solder joint failure due to the thermal mismatch between the package body materials. A finite element model of the PBGA package was established by using Ansys finite element simulation software. By selecting material parameters, finite element elements, applying loads and calculations, the flip-chip solder joints in the package were studied at an aging temperature of 150 ℃ and a time of500 h. The results of strain and displacement, and the use of energy method to analyze the failure of solder joints from the perspective of cumulative plastic strain energy density and cumulative plastic strain. The results showed that the stress, strain, accumulated plastic strain, and accumulated plastic strain energy of the corner solder joints were the largest in the package. The corner solder joints were the most vulnerable solder joints.

关 键 词：PBGA 热时效 倒装焊点 

分 类 号：O242.21[理学—计算数学] TG454[理学—数学]