基于SiP技术的VCSEL阵列微系统封装  

VCSEL Array Microsystem Packaging Based on SiP Technology

作　　者：王栎皓 付登源 赵俊元 赵松庆[4,5] 吴根水 陈海燕[4,5] 朱银芳 杨晋玲[1,2,3] Wang Lihao;Fu Dengyuan;Zhao Junyuan;Zhao Songqing;Wu Genshui;Chen Haiyan;Zhu Yinfang;Yang Jinling(Engineering Research Center for Semiconductor Integrated Technology,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China;Center of Materials Science and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing 100049,China;State Key Laboratory of Transducer Technology,Shanghai 200050,China;China Airbome Missile Academy,Luoyang,Henan 471009,China;Aviation Key Laboratory of Science and Technology on Airbome Guided Weapons,Luoyang,Henan 471009,China)

机构地区：[1]中国科学院半导体研究所半导体集成技术工程研究中心,北京100083 [2]中国科学院大学材料科学与光电工程中心,北京100049 [3]传感器技术国家重点实验室,上海200050 [4]中国空空导弹研究院,河南洛阳471009 [5]航空制导武器航空重点实验室,河南洛阳471009

出　　处：《激光与光电子学进展》2021年第21期214-219,共6页Laser & Optoelectronics Progress

基　　金：航空科学基金项目(20170136003)。

摘　　要：针对半实物仿真系统的需求,基于系统级封装技术提出了一款由垂直腔面发射激光器(VCSEL)激光器阵列、激光器驱动芯片、电源芯片等组成的微系统,并介绍了基于微机电系统微纳加工技术的VCSEL激光器阵列的制造工艺流程。该激光器的封装方法具有集成度高、可靠性高等特点,相比于其他驱动及封装方法大大提高了驱动效率和空间利用率,因此在光学成像、通信、互联等领域具有广泛应用前景,为实现半实物仿真中激光成像发生器奠定了基础。This paper proposes a microsystem composed of vertical cavity surface-emitting laser arrays,laser driver chips,and power chips based on system in package technology to meet the needs of the hardware-in-the-loop simulation system.In addition,a manufacturing process flow based on microelectromechanical systems technology was developed.The packaging method has a high level of integration and high reliability.Driving efficiency and space utilization are significantly improved compared with other driving and packaging methods.Consequently,it has broad application prospects in optical imaging,communication,and interconnection,laying the groundwork for realizing the laser-imaging generator in semi-physical simulation systems.

关 键 词：激光光学 激光器阵列 垂直腔面发射激光器 系统级封装 微系统 微机电系统 微纳加工 

分 类 号：O436[机械工程—光学工程]