临时键合和解键合工艺技术研究  

Research on Temporary Bonding and Debonding Technology

作　　者：胡晓霞[1] 郑如意 邢莹 芦刚[1] HU Xiaoxia;ZHENG Ruyi;XING Ying;LU Gang(The 45^(th) Research Institute of CETC,Beijing 100176,China;Sanhe Wuatech Co.,Ltd,Hebei Yanjiao 065201,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176 [2]三河建华高科有限责任公司,河北燕郊065201

出　　处：《电子工业专用设备》2021年第6期45-48,共4页Equipment for Electronic Products Manufacturing

摘　　要：超薄晶圆的机械强度低,翘曲度高,为解决其支撑和传输过程中碎片率高的问题,同时也为提高产品良率及性能,通常采用临时键合和解键合的工艺方法。通过介绍临时键合工艺和解键合工艺技术,并根据工艺需求提出了临时键合设备和解键合设备的结构和原理。Ultra-thin wafers have low mechanical strength and high warpage.Temporary bonding and debonding process methods are usually used to solve the problem of high fragmentation rate during the support and transmission process,and to improve the product yield and performance.Through introducing temporary bonding technology and debonding technology,proposes the structure and principle of temporary bonding equipment and debonding equipment according to the process requirements.

关 键 词：临时键合 解键合 晶圆 载片 

分 类 号：TN405[电子电信—微电子学与固体电子学]