应用工艺性及互联可靠性定型试验(续完)  

Application Processability and Interconnection Reliability Type Test(Continued)

作　　者：孙磊[1,2] 刘哲 邱华盛[1] 王玉[1] 赵丽[1] 郑正德[1] SUN Lei;LIU Zhe;QIU Huasheng;WANG Yu;ZHAO Li;ZHENG Zhengde(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057 [2]中兴通讯电子制造职业学院

出　　处：《电子工艺技术》2022年第1期54-59,共6页Electronics Process Technology

摘　　要：经过工艺性摸底试验后,各厂家根据试验的结果,针对存在的差距和各自的问题,在原有焊膏样品的基础上对产品配方和生产工艺过程进行了反复的改善和内部测试。以各国内厂家改善后的焊膏样品为对象,模拟正常的SMT生产工序,对试验板进行印刷、贴片和回流焊接。通过SPI和AOI数据以及外观和X-ray的检查结果,评估各种焊膏的生产工艺性能。通过残留物定量测量、焊点合金层观察和环境可靠性评估,对焊点的可靠性进行评估。以工艺性和可靠性试验的结果作为产品定型的依据。After the process test,according to the test results,the manufacturers have repeatedly improved and tested the product formula and production process on the basis of the original solder paste samples.Taking the solder paste samples improved by domestic manufacturers as the object,the normal SMT production process is simulated,and the test board is printed,bonding and reflow soldering.The production process performance of various solder pastes is evaluated by SPI and AOI data,appearance and X-ray inspection results.The reliability of solder joints is evaluated by quantitative measurement of residues,observation of solder joint alloy layer and environmental reliability evaluation.Take the results of processability and reliability test as the basis for product finalization.

关 键 词：焊膏 工艺性 可靠性 微电子装备 

分 类 号：TN606[电子电信—电路与系统]