电镀参数对电镀镍层性能的影响  

Effect of Electroplating Parameters on the Performance of Electroplating Nickel Layer

作　　者：李彭瑞 任春江[1] 章军云[1] 陈堂胜[1] LI Pengrui;REN Chunjiang;ZHANG Junyun;CHEN Tangsheng(Nanjing Electronic Devices Institute,Nanjing 210000,China)

机构地区：[1]南京电子器件研究所化合物部,江苏南京210000

出　　处：《电镀与精饰》2022年第2期26-29,共4页Plating & Finishing

摘　　要：采用脉冲电流方法制备电镀镍层,并利用扫描电镜、光学轮廓仪、硬度计等测试方法研究了电镀参数中的溶液温度和pH对电镀镍层的表面形貌、粗糙度、显微硬度和SiC/Ni刻蚀选择比的影响。结果表明:当镀液温度在45~60℃时,镀镍层表面形貌变化不大,但是随着镀液温度的升高和镀液pH的增大,粗糙度呈先减小后增大的趋势,显微硬度和SiC/Ni刻蚀选择比均呈先增大后减小的趋势。电镀液温度为55℃,pH在4.0~4.4时,可获得具有良好的质量、显微硬度且SiC/Ni刻蚀选择比的镍镀层。The electroplating nickel layer was prepared by pulse current method,and the effects of solution temperature and pH on the surface morphology,roughness,microhardness and SiC/Ni etching selectivity ratio of electroplating nickel layer were investigated by scanning electron microscope,op‐tical profilometer and hardness tester.The results showed that when the bath temperature increased from 45℃to 60℃,the surface morphology of nickel plating layer had little change,but with the increase of bath temperature and pH,the roughness decreased first and then increased,the microhardness and the SiC/Ni etching selection ratio both increased first and then decreased.When the bath temperature was 55℃and pH was 4.0‐4.4,the nickel coatings with good quality,microhardness and etching selectivity ratio of SiC/Ni can be obtained.

关 键 词：电镀镍 微观结构 显微硬度 SiC/Ni 工艺参数 

分 类 号：TQ153.2[化学工程—电化学工业]