Al_(2)O_(3)/Cu的界面微观结构及封接性能  

Microstructure and Sealing Performance of Al_(2)O_(3)/Cu Brazed Joint

作　　者：范彬彬 赵林 谢志鹏 康丁华 刘溪海 FAN Binbin;ZHAO Lin;XIE Zhipeng;KANG Dinghua;LIU Xihai(School of Materials Science and Engineering,Jingdezhen Ceramic University,Jingdezhen 333403,China;State Key Lab of New Ceramics and Fine Processing,Department of Materials Science and Engineering,Tsinghua University,Beijing 100084,China;Loudi City Andeans Electronic Ceramics Co.Ltd.,Loudi 417000,China)

机构地区：[1]景德镇陶瓷大学材料科学与工程学院,景德镇333403 [2]清华大学材料学院新型陶瓷与精细工艺国家重点实验室,北京100084 [3]娄底市安地亚斯电子陶瓷有限公司,娄底417000

出　　处：《硅酸盐通报》2022年第1期241-248,共8页Bulletin of the Chinese Ceramic Society

基　　金：国家自然科学基金(52072201,51962011)。

摘　　要：采用活化Mo-Mn法和活性金属钎焊(AMB)工艺对Al_(2)O_(3)陶瓷进行金属化处理,分别研究了两种金属化工艺的界面形貌、新相的形成及显微结构的演变,并测试了Al_(2)O_(3)/Cu的力学性能和气密性。研究表明:采用活化Mo-Mn法的封接界面处出现玻璃相的迁移,形成了立方相MnAl_(2)O_(4),可以提高封接强度。AMB工艺中活性元素Ti与Al_(2)O_(3)反应依次形成厚度为0.64μm的TiO和1.03μm的Cu_(3)Ti_(3)O。各层间热膨胀系数(CTE)的差异给钎焊接头提供了良好的热弹性相容性且降低了残余应力。活化Mo-Mn法的封接强度((60.2±7.7)MPa)比AMB工艺((43.1±6.9)MPa)高,但在气密性方面两者并无明显差别(均在2.3×10^(-11) Pa·m^(3)·s^(-1)左右)。Al_(2)O_(3) ceramics were metallized by the activated Mo-Mn method and the active metal brazing(AMB)process.The interfacial microstructure,formation mechanism of new phases and microstructure evolution of the brazed joints were investigated,and the mechanical properties and the He leakage rate of Al_(2)O_(3)/Cu specimen were tested.The results show that for activated Mo-Mn method,the formation of cubic phase MnAl_(2)O_(4) is due to the migration of the glass phase at the brazing interface,which can improve the strength of the joint.During the AMB process,the active element Ti and Al_(2)O_(3) form TiO and Cu_(3)Ti_(3)O layers,with a thickness of 0.64μm and 1.03μm,respectively.The difference of coefficient of thermal expansion(CTE)between layers provides good thermoelastic compatibility and reduces residual stress.The bonding strength of samples prepared by the activated Mo-Mn method((60.2±7.7)MPa)is higher than that of samples prepared by the AMB process((43.1±6.9)MPa)while the He leakage rates are similar(both around 2.3×10^(-11) Pa·m^(3)·s^(-1)).

关 键 词：陶瓷-金属封接 Al_(2)O_(3)/Cu界面 活化Mo-Mn法 AMB工艺 金属化 封接性能 

分 类 号：TG454[金属学及工艺—焊接]