树脂塞孔研磨过程中镀覆孔拐角露铜的探究  

Study on copper exposure at the corner of plated hole by grinding process of resin plug hole

作　　者：宋国平 陈伟亨 刘中山 Song Guoping;Chen Weiheng;Liu Zhongshan(DELTON TECHNOLOGY(GUANGZHOU)INC,Guangzhou 510730 China)

机构地区：[1]广州广合科技股份有限公司,广东广州510730

出　　处：《印制电路信息》2022年第2期10-14,共5页Printed Circuit Information

摘　　要：文章通过对树脂塞孔和树脂研磨的设计、制作和过程管控等方面进行优化,改善树脂塞孔板的金属化孔口铜厚不足及基材缺陷问题,防止后续镀铜后镀层分离报废产生,从而改善产品品质,提高客户满意度。This paper optimizes the design,production and process control of resin plug holes and resin grinding to improve the insufficient copper thickness of the metalized orifices of the resin plug holes and the defects of the exposed substrate,and prevent subsequent copper plating after plating separation and scrap so as to improve product quality and increase customer satisfaction.

关 键 词：树脂塞孔 金属化孔 拐角铜厚 

分 类 号：TN41[电子电信—微电子学与固体电子学]