正交试验优选G11掩模版涂胶工艺  

Optimization of Coating Process for G11 Mask by Orthogonal Design

作　　者：林超 郑宇辰 孙多卫 周荣梵 林伟 LIN Chao;ZHENG Yuchen;SUN Duowei;ZHOU Rongfan;LIN Wei(R&D Department of Chengdu Newway Photomask Making Co.,Ltd.,Sichuan 610096,China)

机构地区：[1]成都路维光电有限公司研发部,四川610096

出　　处：《集成电路应用》2022年第1期32-37,共6页Application of IC

摘　　要：阐述为研究和实现11代生产线(G11)掩模版的涂胶工艺,验证最佳的旋转涂胶工艺参数。采用正交试验法,以转速、旋转加速度及时间为指标,优选出旋转涂胶的最佳工艺参数组合,并以色差、膜厚及均匀性指标来评价工艺,同时本文利用积分法量化了色差。从而对正交试验最佳涂胶工艺组合和不同组合进行涂胶及蚀刻后线缝、线宽特征值(Critical Dimension, CD)研究,得到最优涂胶工艺组合的膜厚平均值为732.3nm,膜厚均匀性为2.92%;线缝、线宽CD精度偏差分别为69nm和66nm。分析表明,研究证实旋转涂胶的转速ω及时间t对膜厚及均匀性有较大影响,旋转加速度及排风压力对色差及均匀性有影响。通过研究不同膜厚及膜厚均匀性对图形CD精度的影响发现,膜厚偏大或偏小对图形CD精度均有影响,但膜厚的均匀性对图形的CD精度及均匀性影响更大。Objective: In order to study and realize self-coating process of the 11 th generation LCD panel mask and verify the best spin coating process parameters. Method: Orthogonal test was applied in optimizing the processing technique, taking the contests of rotation speed, acceleration and time as the index to get the best combination of technological parameters. In addition, the Mura, film thickness and uniformity are used as indicators to evaluate the process. This paper uses the integral method to quantify the Mura. Result:The result showed that the average film thickness of the best spin coating process is 732.3 nm and the uniformity is 2.92% compared with the other spin coating conditions. The critical dimension(CD) precision deviation of space CD and line CD are 69 nm and 66 nm respectively after etching. Conclusion: The results show that rotational speed and time have great influence on film thickness and uniformity. Rotational acceleration and exhaust pressure have influence on Mura and uniformity. By studying the influence of different film thickness and uniformity on the accuracy of critical dimension(CD), it is found that the larger or smaller film thickness has an impact on the accuracy of CD. The film thickness uniformity has a greater impact on the accuracy and uniformity of CD.

关 键 词：掩模版 正交试验 旋转涂胶 液晶显示 

分 类 号：TN141.9[电子电信—物理电子学] TP391.9[自动化与计算机技术—计算机应用技术]